The Xenemetrix Legacy of Innovation Continues
coins

  • PSQ and BPSG Plating on Coins.
  • Ag coverage on film products.
  • Cr and Zn plating on ferrous parts Phosphor films.
  • Al/Ta film on silicon wafers.
  • Tb/Co, Tb/Co/Ni/Fe, Co/Re/Zr on wafers.
  • TiW, Ni, Ag/TiW/Ni on Si wafers.
  • Bronze plating on coin blanks.
  • Copper plating on zinc pennies.
  • Al/Si/Cu films on Si wafers.
  • Pt layer on silica.
  • Tb/Fe films on silica.
  • Fe-Tb, Fe-Co-Gd-Tb films on silica wafers.
  • In/Cu/Mo/Cr film layer over glass.
  • Zn/Au alloy film on silicon substrate Co-Gd-Tb-Ar and Tb-Co/Ni-Fe over glass.
  • Cr plating thickness over brass.
  • Al-Si-Cu films, Ge epi-layers over Si.